3M™ 9-5-5433 Flame-Retardant Low Static Film Tape, 5 yd L x 9 in W, 2.7 mil THK, PET Liner, Silicon Adhesive, DuPont™ Kapton® Polyimide Backing

3M™ Film Tape, Flame-Retardant Low Static, Series: 5433, 5 yd Length, 9 in Width, 2.7 mil Thickness, PET Liner, Amber, Silicon Adhesive, DuPont™ Kapton® Polyimide Backing, 20 in-oz Adhesion Strength, 33 in-lb Tensile Strength, 500 deg F Maximum Operating, -100 deg F Minimum Operating, Specifications Met: UL 510, ASTM D3330, ASTM D3759, ASTM D3652, ASTM D149

3M™ 5433 low static polyimide film tape is a translucent, amber film backing made from DuPont™ Kapton® high temperature polyimide film with a silicone adhesive offering extremely low electrostatic discharge properties. 3M™ 5433 produces very low static charge during unwind and removal from printed circuit boards and other electronic components making it desirable in static sensitive applications where a thin tape is required. Use low static polyimide film tape for harsh environment, high temperature insulating and masking applications where ESD is a concern, such as electronic manufacturing, as well as, industrial manufacturing processes containing combustibles where ESD can cause explosions. Low static polyimide film tape virtually eliminates circuit board degradation due to electrostatic discharge, helping reduce costly board waste due to component failure in such items as smartphones, LCD screens and tablets. DuPont™ Kapton® polyimide film is flame retardant, chemical-resistant, won't soften at higher temperatures and offers excellent electrical insulation performance, use to temporarily secure and mask components during the wave solder or solder dip process, mask circuit boards to shield gold fingers from the solder material and prevent unwanted electrical connections. Polyimide tape is stable over a wide temperature range, used as a protection layer on fragile electronic components. Low ESD polyimide tape works as a great insulator for static sensitive electronic components such as integrated circuits. 3M™ 5433 is easy to trim and can be used as a temporary dust cover for ports in devices. Operates up to 500 deg F, works well in the fabrication industry as a clean release surface for parts cured at elevated temperatures where ESD is a concern. Meets flame retardant requirements of UL510.