3M™ 3M 7419 CIRCLE-0.938"-500 Low Static Non-Silicon Film Tape With (500) 0.938 in Dia Circle, 1.8 mil THK, Film Liner, Acrylic Adhesive, DuPont™ Kapton® Polyimide Backing

3M™ Film Tape, Low Static Non-Silicon, Series: 7419, 1.8 mil Thickness, Film Liner, Amber, 3.02 in Diameter Core, Acrylic Adhesive, DuPont™ Kapton® Polyimide Backing, 5 in-oz Adhesion Strength, 260 deg C Maximum Operating, Specifications Met: ASTM D3330 Part F, ASTM D3652

3M™ 7419 low static, non-silicone polyimide film tape is a translucent, amber film backing made from DuPont™ Kapton® high temperature polyimide film with an acrylic adhesive offering extremely low electrostatic discharge properties. 3M™ 7419 produces very low static charge during unwind and removal from printed circuit boards and other electronic components making it desirable in static sensitive applications. Use low static polyimide film tape for harsh environment, high temperature insulating and masking applications where ESD is a concern, such as electronic manufacturing, as well as, industrial manufacturing processes containing combustibles where ESD can cause explosions. The non-silicone adhesive formulation lessens the potential for silicone contamination which can interfere with subsequent bonding or conformal coating operations. Low static, non-silicone polyimide film tape virtually eliminates circuit board degradation due to electrostatic discharge, helping reduce costly board waste because of component failure in such electronics as smartphones, LCD screens and tablets. Specially formulated acrylic adhesive is resistant to typical solder mask temperatures for short periods of time and removes cleanly, use for masking or protecting residue sensitive areas on printed circuit boards during high temperature operations such as wave soldering and solder reflow. Polyimide tape is stable over a wide temperature range, used as a protection layer on fragile electronic components. Polyimide film provides excellent tear and puncture-resistant at high temperatures, while the acrylic adhesive has excellent chemical resistance, ideal for demanding chemical masking applications where ESD is a concern. Designed to remove cleanly from a variety of typical electronic substrates including FR-4, polyimide, gold, copper and silicone after high temperature processing.